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 Home > Products > High density PCB︱HDI PCB
High Density Interconnect PCB
Click:0 From: Hitech Circuits Co.,Limited Date: 2008-02-15
 
Layer Count: 10-layers (HDI PCB with3+4+3 stack up)
Mobile Phone main board
Finish board thickness: 1.0mm
Material: FR4, Tg150
Surface finishing: immersion gold+OSP
Line width and space: 0.13/0.13mm
Special technology: HDI PCB with 3 + 4 + 3 Layers, 4mil Blind and 12mil Buried Via
Impedance control tolerance: +/-8%
Through hold size: 0.3mm      
 
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